synthetic crystalline wafer substrate διαδικτυακή κατασκευή

Product model TO-8X Product name 4J29 Alloy Package With 42 Alloy Cover Flat Plug-In Product formation Material Quantity 1. bottom 4J29 1 2. lead 4J29 5 3. T shaped lead 4J29 1 4. glass insulator DM-305 5 5. cap 4J29 1 FINISH Shell and pins are plated Ni:4~11.43um and Au≥1um;Cap is plated Ni:1.3~11... Διαβάστε περισσότερα

Product name: infrared detector package Applications: infrared detectors Product features: The infrared detector package can provide high-reliability and airtight packaging for refrigerated and uncooled infrared detectors. The main package forms are butterfly ceramic package, ceramic PGA package and ... Διαβάστε περισσότερα

Specifications: Material: --------------------------------------------------------- Sapphire Diameter Tolerance: ------------------------------------------ +0.0, -0.1mm Thickness Tolerance: ---------------------------------------- ±0.1mm Clear Aperture: ----------------------------------------------... Διαβάστε περισσότερα

Material: BK7 Dimension Tolerance: +0.0, -0.1mm Thickness Tolerance: ± 0.1mm Surface quality: 60/40(Standard), 10/5(High Precision) Clear Aperture: >85% Flatness: λ(Standard), λ/10(High Precision) per 25mm@633nm Parallelism: 1' (Standard), 10" (High Precision) Bevel: Διαβάστε περισσότερα

Product name: Robust Iron-Nickel-Cobalt Flatpack With Unusual Lead Forming Finish: Fully plating Au. (Fully plating or selective plating Au.) Plating coating: Package,pin,lid are plated Ni:1.3~11.43um;Package and pins are plated Au≥1.0um Product formation: Material Quantity 1. Cover plate 4J42... Διαβάστε περισσότερα

Product Name Well Suited Metal Package Flat Bottom Package With 1.5mm Depth In Top Seal Plating Coating Fully Plating Au or Selective Plating Au Finish Header and cap is plated Ni:3~11.43um and header is plated Au ≥1.0um and pins are plated Au≥1.3um Product Information Material Quantity 1. Base ... Διαβάστε περισσότερα

Product Name Plug-in Platform Metal Package Plating Coating Fully Plating Au or Selective Plating Au Finish Header and cap is plated Ni:3~11.43um and header is plated Au ≥1.0um and pins are plated Au≥1.3um Product Information Material Quantity 1. Base Kovar 1 2. Brazing ring HlAgCu28 1 3. Glass ... Διαβάστε περισσότερα

With wide direct bandgap(3.4 eV), strong atomic bonds, high thermal conductivity and excellent radiation resistance, GaN is not only short-wave-length optoelectronic material, but also a well alternative material for high temperature semiconductor devices. Based on the stable physical and chemical ... Διαβάστε περισσότερα